Chair: Bernard COURTOIS, CMP, Grenoble, France
Co-Chair: Jean Michel KARAM, MEMSCAP, Bernin, France
 Seville, Spain 5-7 May 2010 |
SYMPOSIUM on
Design, Test, Integration & Packaging of MEMS/MOEMS |
 |
Aim
Presentations | Reviewers | Hotel / Venue & Access | Contacts | Social event | Exhibition & Poster Information | Registration | Panel | Technical program | Conferences | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |
The Organizing Committee thanks the participants from 22 countries for their contributions to the programme and ambiance of DTIP 2010 !
Download Online proceedings
The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
Bernard COURTOIS & Jean-Michel KARAM