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Microfabrication, Integration and Packaging Conference

Chair: Hsiharng YANG, National Chung Hsing U., Taiwan
Co-Chair: Ryutaro MAEDA, AMRI/AIST Tsukuba, Japan

The Microfabrication, Integration and Packaging Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

Programme Committee: To include
Reza GHODSSI, Univ. of Maryland, College Park, USA
Xue chuan SHAN, SIMTech, Singapore
David ALLEN, Cranfield Univ., Bedford, UK
Zhenfeng WANG, SIMTech, Singapore
Eng Hock TAY, National Univ. of Singapore
Juerg DUAL, ETH Zentrum, Zürich, Switzerland
Masayoshi ESASHI, Tohoku Univ., Japan
Henri CAMON, LAAS, Toulouse, France
Yves-Alain PETER, EPM, Montréal, Canada
Bob PUERS, KU Leuven, Belgium
Wolfgang REINERT, Fraunhofer Institute for Silicon Technology, Itzehoe, Germany
Philippe RENAUD, EPFL, Lausanne, Switzerland
Bernd MICHEL, IZM, Berlin, Germany
Yuelin WANG, SIMIT, Shanghai, China
Kazuo SATO, Nagoya Univ., Japan
Andrew TAY, National Univ. of Singapore
Adrian IONESCU, EPFL, Lausanne, Switzerland
Alain BOSSEBOEUF, IEF, Paris-Orsay, France
Matthias WORGULL, FZK, Karlsruhe, Germany
Mohamed HENINI, Univ. of Nottingham, UK
Erik JUNG, Fraunhofer IZM, Germany
Chantal KHAN MALEK, Lab. FEMTO-ST/LPMO, Besançon, France
José Manuel Quero, Escuela Superior de Ingenieros de Sevilla, Spain
Masaaki ICHIKI, Tokyo University, Japan
Skandar BASROUR, TIMA Lab., Grenoble, France
Gou-Jen WANG, National ChungHsing Univ., Taiwan
Russell HALLMAN, National Security Complex, Oak Ridge, USA
Victor M. BRIGHT, Univ. of Colorado at Boulder, USA
Chris van HOOF, IMEC, Leuven, Belgium
Jyh-Cheng YU, Nat'l Kaohsiung 1st U. of Sc.& Tech., Taiwan

Topics

The topics for this Conference include (preliminary):
Integrated processes (micromachining, micromolding, …)
Process integration between MEMS and electronics
Microlithography issues unique to MEMS/MOEMS
Manufacturing
Materials
Assembly technologies
Packaging for harsh environments
MOEMS packaging
RF and microwave packaging
Test structures
Devices and components (sensors, actuators, …)
Dimensional measurements
Physical measurements
Failure analysis
Reliability
Characterization
Process monitoring
Non destructive evaluation