Aim

Presentations | Reviewers | Hotel / Venue & Access | Contacts | Social event | Exhibition & Poster Information | Registration | Panel | Technical program | Conferences | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |

Contacts

Symposium Chair:
Bernard COURTOIS, CMP - Tel.: +33 4 76 57 46 15 - Fax: +33 4 76 47 38 14
Symposium Co-Chair:
Jean-Michel KARAM, MEMSCAP - Tel.: +33 4 76 92 85 00 - Fax: +33 4 76 92 85 10

CAD, Design and Test Conference:
Chair: Pascal NOUET, LIRMM, Montpellier, France
Co-Chair: Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany

Microfabrication, Integration and Packaging:
Chair: Hsiharng YANG, National Chung Hsing U., Taiwan
Co-Chair: Ryutaro MAEDA, AMRI/AIST Tsukuba, Japan

Local secretary: Chantal BENIS-MOREL, CMP - Tel.: +33 4 76 57 46 22 - Fax: +33 4 76 47 38 14