Logo DTIP
Seville, Spain
5-7 May 2010
SYMPOSIUM on

Design, Test, Integration
& Packaging of MEMS/MOEMS
collage

Exhibition

An exhibition will be organized in the framework of the Symposium. CAD software, products, equipments, instruments, foundries offerings, etc. may be exhibited. Exhibitors who will register early enough will be given the opportunity to give a product presentation during the vendor session that will be placed in the Symposium programme. If you plan to exhibit, please contact the Symposium Chair.

Instructions for Poster Presentations

Time

Posters will be mounted during the first break or during the lunch time. Please, make sure to remove all posters mounting material from the board at the end of the DTIP. Posters not removed in time will be taken down by the poster service staff. However, we can not assure any further responsibility for the material.
All posters will be introduced by one slide in 3 minutes each. They will be presented in a plenary session. Detailed timing will be given in the Program.

Poster material

Your poster area can be 2m20 x 0m95 (height x width). Please display the title of your poster with 0m40 high printed capital letters at the top of the poster area. Your poster material should be attached on the surface with tape. Poster mounting materials will be available at the poster service desk. Do not use pins.

Text layout

Give a short and comprehensive review of the basic items of your study. This can be done by dividing your text into several but clearly delineated paragraphs. Remember that it is easy to start reading a paragraph of six lines, but most people avoid one with 30! Please use letter-heights and figure sizes appropriate to read the poster from a distance of 1 m.

Illustration layout

Drawings, diagrams and photos are extremely helpful and often necessary to display results and conclusions. Make sure that your illustrations are easy to understand - do not overload any chart or drawing with information.

We are looking forward to your poster presentation at DTIP.