Logo DTIP
Seville, Spain
5-7 May 2010
SYMPOSIUM on

Design, Test, Integration
& Packaging of MEMS/MOEMS
collage

Plenary invited speakers

Value Added Packaging of Microsystems
fleGrise Erik JUNG, Fraunhofer IZM, Germany

Packaging of sensors and microsystems has since been a challenge from cost and performance point of view. While electronic packaging techniques benefit from law-of-scale of standard packages, Microsystems are unique products, often requiring unique solutions. Also, packaging shall not deteriorate the performance of the sensor component, e.g. due to stress or relaxation, nor impede the measuring itself by e.g. blocking access. Fortunately, packaging technologies can be leveraged for such systems in a way, where the housing itself is -in contrast to the electronics- not anymore just a cost factor, but an enabling part of the system itself. This contribution will provide insight on the factors determining performance and reliability of sensor based Microsystems as well as the benefits of using the protective housing as value-added to the system functionality.

Energy Autonomous Systems
fleGrise Eugenio CANTATORE, Eindhoven University of Technology, The Netherlands

Recent years have seen a strong focus of the IC research community towards increasing the energy efficiency of electronic systems. This continued effort has involved all kinds of electronic functions: DSPs (reaching the 10µW/MMAC according Gene’s law), data converters and sensor front-ends (the FOM of recent ADCs is better than 50fJ/conversion), radios (reaching the level of 3nJ per received-transmitted bit).
Exploiting this ever-increasing energy efficiency, improved battery technology and the advances in energy harvesting, miniaturized electronic sensors that do not need to be recharged for their whole operational life and can communicate to build up an energy-autonomous system are possible nowadays .
A working group has been setup by CATRENE1 to study the state and the trends of these “energy autonomous systems”.
This paper will summarize the findings of the working group, with special attention to the innovative MEMS applications related to this emerging technology.