Logo DTIP
Cannes Côte d'Azur, France
25-27 April 2012
SYMPOSIUM on

Design, Test, Integration
& Packaging of MEMS/MOEMS
collage

The Organizing Committee thanks the participants from 15 countries for their contributions to the programme and ambiance of DTIP 2012!

Download the Proceedings (PDF).

The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
Bernard COURTOIS & Jean-Michel KARAM

1
3