Chair: Bernard COURTOIS, CMP, Grenoble, France
Co-Chair: Jean Michel KARAM, MEMSCAP, Bernin, France
 Barcelona, Spain 16-18 April 2013 |
SYMPOSIUM on Design, Test, Integration & Packaging of MEMS/MOEMS |
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Aim
Paper presentation | Reviewer access | Hotel / Venue & Access | Contacts | Social event | Registration | Technical program | Conferences: | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |
The Organizing Committee thanks the participants from 21 countries for their contributions to the programme and ambiance of DTIP 2013!
The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
Bernard COURTOIS & Jean-Michel KARAM