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Press Release - IRT Nanoelec and CMP Announce World’s First Multi-Project Wafer Service with Silicon Photonics on 310nm SOI Platform

2016-07-11 IRT Nanoelec, an R&D consortium focused on information and communication technologies (ICT) using micro and nanoelectronics, and CMP, Circuits Multi-Projets®, a service (...) Read more
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CMP Annual Report 2015

CMP Annual report 2015 is online. Read more
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STMicroelectronics Makes State-of-the-Art BCD8sP Smart-Power Technology Available for Prototyping through CMP

2015-01-21 STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and CMP (Circuits Multi Projets®) have made ST’s BCD8sP (...) Read more
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Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration

2015-05-06 Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration Read more : http://www.3dincites.com/2015/04/executive-viewpoint-inside-multi-project-wafer-program-3d-integr Read more
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ams and STMicroelectronics join to launch breakthrough solution for secure NFC mobile payments

2015-02-27 Reference design combines ams’ boostedNFC™ technology with ST’s NFC controller and Secure Element to provide fastest, safest, and most reliable secure contactless transactions in phones (...) Read more
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CMP Annual Report 2014

2015-02-06 CMP Annual Report 2014 is online. Read more Read more
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French Institutes IRT Nanoelec and CMP Team up to Offer World’s First Service for Post-process 3D Technologies on Multi-Project-Wafer

2015-03-06 IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a (...) Read more