STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and CMP (Circuits Multi Projets®) have made ST’s BCD8sP (...)
Executive Viewpoint: Inside a Multi-Project Wafer Program for 3D Integration
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Reference design combines ams’ boostedNFC™ technology with ST’s NFC controller and Secure Element to provide fastest, safest, and most reliable secure contactless transactions in phones (...)
IRT Nanoelec, an R&D consortium focused on ICT using micro- and nanoelectronics, and CMP, which provides prototyping and low-volume production of ICs and MEMS, are launching a (...)
PCIM Europe (Power conversion and Intelligent Motion) is the international leading exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management.
International exhibitors inform themselves in three exhibition halls about the newest products, trends and developments in the power electronics industry. PCIM Europe is the forum for technologies for the whole value chain of the power electronics industry, from the components to the intelligent system.
The European user market informs itself at PCIM Europe about products and solutions of the whole industry.
CMP will be present as an exhibitor (booth 348) and will be pleased to present you our new offers, come and see us!
The DATE 2017 exhibition will run for three days (Tuesday - Thursday inclusive). It is a unique networking opportunity for vendors of tools and services for hardware and embedded software for the design, development and test of Systems-on-Chip, IPs, Embedded Systems, ASICs, FPGAs and PCBs including a broad range of design reuse technologies and services. The spacious exhibition area will be located directly in the entrance and registration area of Alpexpo with direct connection to the session rooms and benefits from natural daylight. As the area is positioned centrally and will host the coffee break area as well, a constant frequentation will be guaranteed.
DATE arranges a number of special events and features in the exhibition area to allow busy conference delegates more time and justification to visit the booths, such as
an Exhibition Reception extended delegate coffee breaks a full programme in the Exhibition Theatre which will combine presentations by exhibiting companies, best-practice reports by industry leaders and selected conference special sessions.
All these activities are intended to make DATE a more attractive place for industry professionals to get in touch with each other and do business.
The DATE conference annually attracts over 1,400 conference delegates and continues to be a growing event with increasing exhibition visitor numbers and higher overall number of conference attendees compared to past DATE conferences.
In 2016, SEMICON Europa will be back in Grenoble (France) following the long-term strategy for the event, which rotates in alternate years between Grenoble (France) and Dresden (Germany), two of Europe’s largest microelectronic clusters. With the support of public and private stakeholders across Europe, the new SEMICON Europa strategy enables exhibitors to reach new audiences and business partners and take full advantage of the strong microelectronic clusters in Europe.
The annual CMP user’s meeting will take place on Thursday 26 January 2017 at IPGP, Paris. The meeting is open to every person from academia or research laboratories or private companies, using, or interested in CMP services.
This year, in addition to the balance sheet 2016, CMP will present new offers:
These themes will be presented by experts in the field.
For the most updated information, please check regularly this page. Read more
Jean-Christophe Crébier, CMP
Statistics and evolution for 2016,
Kholdoun Torki, CMP
STMicroelectronics MPW services,
Romain Verly, CMP
28nm FD-SOI RTL to GDS design flow tutorial, new developments,
Christelle Rabache, CMP
OxRAM memories: a disruptive technology for disruptive designs,
Luca Perniola, CEA LETI
Break + Discussion
ams MPW services,
Kholdoun Torki, CMP
Hot Topics at ams in 2017,
Andreas Wild, ams
Flip-chip & Advanced packaging,
Lyubomir Kerachev & Olivier Guiller, CMP
More than Moore MPW services,
Azedine Manaa, CMP
Photonic IC design using PhoeniX Software solutions,
ECOC is the largest conference on optical communication in Europe, and one of the most prestigious and long-standing events in this field worldwide. In September 2016 the 42nd edition of ECOC will take place in Düsseldorf, Germany. This event will showcase state of the art results which bridge the gap between basic science and applications.
About ESTC Organized by IEEE-CPMT since 2006, the Electronics System-Integration Technology Conferences (ESTC) series is the premier venue for academics and industry to present and discuss the latest developments in assembly and interconnection technology and new applications. ESTC completes the triumvirate together with ECTC in the United States and EPTC in Singapore and thus supports the global community of electronics packaging engineers and scientists.
Cette année, en plus des traditionnels exposés scientifiques et posters des doctorants, une large place sera faite aux échanges sur le devenir de notre GDR, en vue du renouvellement prévu en 2017. Ce colloque sera aussi l’occasion de présenter le regroupement de la communauté de l’architecture et du logiciel embarqué au sens large. Ainsi, nous aurons à redessiner collectivement les contours de notre GDR ainsi que nos thématiques.
Le colloque est organisé autour de sessions posters, de tables rondes, de discussions, et de rencontres. Cette année, une session "démo" est également proposée. Elle accueillera des présentations d’outils et de plate-formes mutualisables au sein de la communauté.
DTIP2016 will be the 18th edition of the Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. This unique single-meeting event brings together participants interested in MEMS/MOEMS processing and those interested in design tools and methods to facilitate the design of MEMS/MOEMS. All aspects including design, modeling, testing, micro-machining, integration and packaging of structures, devices and systems are addressed in two main Conferences, Special Sessions and Invited Talks. Selected papers will appear in IEEE Xplore and extended papers would be submitted in a special issue of an indexed journal. We look forward to welcoming you in Budapest. Marta Rencz & Pascal Nouet
ACSIEL organise en 2016, 4 journées dans 4 régions différentes attractive pour nos adhérents. Ces journées sont axées sur des rencontres professionnelles, des tables rondes, des stands, des démonstrations...
La 2ème JRE aura lieu le19 mai à SUPELEC, Ile-de-France. Adresse : SUPELEC Plateau de Moulon 3 Rue Joliot Curie 91190 Gif-sur-Yvette