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27-31 March 2017: DATE (booth #17), Lausanne, Switzerland

The DATE 2017 exhibition will run for three days (Tuesday - Thursday inclusive). It is a unique networking opportunity for vendors of tools and services for hardware and embedded software for the (...) Read more
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14 April 2017: A full day training about “designing with FD-SOI technologies”, San Jose, CA

During the full day training on “Designing with FD-SOI Technologies ”, world-renown professors and scientists from UC Berkeley, Stanford, Toronto and Lund Universities and STMicroelectronics will (...) Read more
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16-18 May 2017: PCIM Europe 2017 (booth #348), Nuremberg, Germany

PCIM Europe (Power conversion and Intelligent Motion) is the international leading exhibition for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. International (...) Read more
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MiNaPAD Forum 2017, 17-18 May, Grenoble, France

Program: MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » which be held in Grenoble, France, on WTC congress center on May 17,18, 2017 MiNaPAD is (...) Read more
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DTIP

Come and see us ! Read more
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ECTC (booth #517)

Come and see us ! Read more
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DAC (booth #320)

Come and see us ! Read more
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ECOC (booth #199)

Come and see us ! Read more
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DesignCon (booth #406)

Santa Clara, CA, USA Read more
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European MEMS SUMMIT

Come and see us ! Read more
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Annual CMP user’s meeting

26 January 2017 - Paris, Fr Information Users’ meeting is open to every person from academia or industry, using or interested in the CMP services. CMP’s Agenda Annual User’s Meeting The annual (...) Read more
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ESTC 2016 (booth 24) 13–16 September 2016

World Trade Center, Grenoble, France Read more
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JRE ILE DE FRANCE - 19 May 2016 -

SUPELEC - Gif-sur-Yvette (Plateau de Saclay) Read more
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DATE (Booth: 6)

Dresden, Germany Read more