The annual CMP user’s meeting will take place on Thursday 26 January 2017 at IPGP, Paris.
The meeting is open to every person from academia or research laboratories or private companies, using, or interested in CMP services.
This year, in addition to the balance sheet 2016, CMP will present new offers:
- Advanced packaging,
- Non-volatile memory.
These themes will be presented by experts in the field.
For the most updated information, please check regularly this page.
|09:20-09:30||Introduction,||Jean-Christophe Crébier, CMP|
|09:30-09:45||Statistics and evolution for 2016,||Kholdoun Torki, CMP|
|09:45-10:05||STMicroelectronics MPW services,||Romain Verly, CMP|
|10:05-10:20||28nm FD-SOI RTL to GDS design flow tutorial, new developments,||Christelle Rabache, CMP|
|10:20-10:40||OxRAM memories: a disruptive technology for disruptive designs,||Luca Perniola, CEA LETI|
|10:40-11:10||Break + Discussion|
|11:10-11:30||ams MPW services,||Kholdoun Torki, CMP|
|11:30-11:50||Hot Topics at ams in 2017,||Andreas Wild, ams|
|11:50-12:25||Flip-chip & Advanced packaging,||Lyubomir Kerachev & Olivier Guiller, CMP|
|12:25-12:40||More than Moore MPW services,||Azedine Manaa, CMP|
|12:40-13:00||Photonic IC design using PhoeniX Software solutions,||Luis Jorge, PhoeniX Software|
|13:00-13:10||Closing remarks,||Jean-Christophe Crébier, CMP|
|13:10-14:00||Lunch + Discussion|
|14:00||End of CMP users annual meeting.|