ECOC (booth #199) 17-21 Sept 2017 Gothenburg - Sweden

43rd European Conference on Optical Communication

From 18 to 20 September 2017, CMP (booth #199) will exhibit at The largest Conference on Optical Communication in Europe and one of the largest and most prestigious events in this field worldwide. Come and see us !

The Nordic countries are happy to welcome ECOC back to Scandinavia, a high-tech innovation hub that successfully merges Communications and Optical Technologies within a creative business and scientific context. Gothenburg, Sweden, is in the heart of Scandinavia, with a characteristic maritime scenery at the waterfront, and the special Nordic light which has inspired artists for centuries.

Press Release


IRT Nanoelec and CMP Announce World’s First Multi-Project Wafer Service with Silicon Photonics on 310nm SOI Platform
GRENOBLE, France – 11 July, 2016 – IRT Nanoelec, an R&D consortium focused on information and communication technologies (ICT) using micro and nanoelectronics, and CMP, Circuits Multi-Projets®, a service organization in ICs and MEMS prototyping and low volume production, today announced the IC industry’s first multi-project wafer (MPW) process for fabricating silicon-photonics devices on a 310nm silicon on insulator (SOI) platform. The MPW service also includes compatible IC MPW services and the first service for post-process 3D integration on multi-project wafers. IRT, which is headed by CEA-Leti, and CMP announced that service in 2015.

Floor plan: ECOC floorplan 2017