Users’ meeting is open to every person from academia or industry, using or interested in the CMP services.
The meeting of 2016 was held on 4 February 2016 at IPGP, Paris, Paris. The meeting was focused on the participation of our partners, (Agenda) especially with the following presentations:
Slides presented (PDF):
02 CMP statistics and evolution for 2015
03 STMicroelectronics MPW services
04 B55 Technology Overview
05 ams MPW services
06 New platform for Photonic integrated circuit of CEA LETI’ MPW activity
07 3D technologies wafer service
08 Development of Flip Chip assembly services
09 MEMS MPW services
10 28nm FD-SOI RTL to GDS design flow tutorial.