Annual users’ meetings

The annual CMP users’ meeting has taken place on Thursday 26 January 2017 at IPGP, Paris.

This year, in addition to the balance sheet 2016, CMP has presented new offers:

  • Advanced packaging,
  • Photonic,
  • Non-volatile memory.

Experts in the field presented these themes.

Presented slides

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Introduction, Jean-Christophe Crébier, CMP
Statistics and evolution for 2016, Kholdoun Torki, CMP
STMicroelectronics MPW services, Romain Verly, CMP
28nm FD-SOI RTL to GDS design flow tutorial new developments, Christelle Rabache, CMP
OxRAM memories: a disruptive technology for disruptive designs, Luca Perniola, CEA LETI
ams MPW services, Kholdoun Torki, CMP
Hot Topics at ams in 2017, Andreas Wild, ams
Flip-chip & Advanced packaging, Lyubomir Kerachev & Olivier Guiller, CMP
More than Moore MPW services, Azedine Manaa, CMP
Photonic IC design using PhoeniX Software solutions, Luis Jorge, PhoeniX Software