The annual CMP users’ meeting has taken place on Thursday 26 January 2017 at IPGP, Paris.
This year, in addition to the balance sheet 2016, CMP has presented new offers:
- Advanced packaging,
- Non-volatile memory.
Experts in the field presented these themes.
Introduction, Jean-Christophe Crébier, CMP
Statistics and evolution for 2016, Kholdoun Torki, CMP
STMicroelectronics MPW services, Romain Verly, CMP
28nm FD-SOI RTL to GDS design flow tutorial new developments, Christelle Rabache, CMP
OxRAM memories: a disruptive technology for disruptive designs, Luca Perniola, CEA LETI
ams MPW services, Kholdoun Torki, CMP
Hot Topics at ams in 2017, Andreas Wild, ams
Flip-chip & Advanced packaging, Lyubomir Kerachev & Olivier Guiller, CMP
More than Moore MPW services, Azedine Manaa, CMP
Photonic IC design using PhoeniX Software solutions, Luis Jorge, PhoeniX Software