| Online Proceedings are available on the following Open Archives |
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| Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2012 - |
| 25-27 April 2012, Cannes, Côte d'Azur, France |
| This series of Symposia is a unique single-meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in-depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. |
| [DTIP 2012 Conference Site] |
| 9th European Workshop on Microelectronics Education - EWME 2012 - |
| 9-11 May 2012, Grenoble, France |
EWME 2012 is the ninth Workshop on microelectronics education to take place in Europe. The previous ones were held in Grenoble (1996), Noordwijkerhout (1998), Aix-en-Provence (2000), Vigo (2002), Lausanne (2004), Stockholm (2006), and Budapest (2008), and Darmstadt (2010). EWME is held every second year in Europe, while MSE (Microelectronic Systems Education) is held every other year in the USA.
30 years of CMP: the Workshop will be the opportunity to celebrate the 30 years of CMP. Testimonials by world-renowned scientists, industry leaders and entrepreneurs will be offered. |
| [EWME 2012 Conference Site] |
| 18th International Workshop on Thermal investigations of ICs and Systems - THERMINIC 2012 - |
| 25-27 September 2012, Budapest, Hungary |
| THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. These trends are calling for thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system’s cost. The growing power dissipated in a package, the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system. |
| [THERMINIC 2012 Conference Site] |
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