Logo DTIP
Aix-en-Provence, France
11-13 May 2011
SYMPOSIUM on

Design, Test, Integration
& Packaging of MEMS/MOEMS
collage

AugustThe Organizing Committee thanks the participants from 17 countries for their contributions to the programme and ambiance of DTIP 2011 !

Online proceedings

The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
Bernard COURTOIS & Jean-Michel KARAM