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CAD, Design and Test Conference

Chair: Tarik BOUROUINA, ESIEE, Noisy-le-Grand, France
Co-Chair: Aurelio SOMA', Politecnico di Torino, Italy

The CAD, Design and Test Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

Programme Committee: To include

Marc DESMULLIEZ, Heriot-Watt Univ., Edinburgh, UK
Yung C. LIANG, National Univ. of Singapore
Raafat MANSOUR, U. of Waterloo, Canada
Robert RUDD, Lawrence Livermore National Lab. Livermore, USA
Waleed FARIS, Int'l Islamic Univ. Malaysia, Malaysia
Kazuhiro HANE, Sendai University, Japan
Rainer LAUR, Univ. of Bremen, Germany
Francis PRESSECQ, CNES, Toulouse, France
Mahnaz SHAMSHIRSAZ, Amirkabir Univ. of Tech., Tehran, Iran
Hisham HADDARA, Si-Ware Systems, Cairo, Egypt
Andrew RICHARDSON, Lancaster University, UK
Patric SALOMON, 4M2C PATRIC SALOMON, Berlin, Germany
Ash PARAMESWARAN, SFU, Canada
Zheng CUI, RAL, Didcot, UK
Tamal MUKHERJEE, Carnegie Mellon Univ., Pittsburgh, USA
Pascal NOUET, LIRMM, France
Shawn BLANTON, Carnegie Mellon Univ., Pittsburgh, USA
Marta RENCZ, BUTE, Budapest, Hungary
Souhil MEGHERBI, Univ. Paris Sud, France
Marc A. POLOSKY, Sandia National Laboratories, Albuquerque, USA
Jian ZHU, Nanjing Electronic Devices Institute, China
Krish CHAKRABARTY, Duke Univ., Durham, USA
Igor BALK, Unison Technologies, Inc., Brighton, USA
Peter SCHWARZ, IIS Schaltungen, Dresden, Germany
Timo VEIJOLA, Helsinki Univ. of Technology, Finland
Gerhard WACHUTKA, Munich Univ. of Technology, Germany
Eric DONZIER, Shlumberger, France
Bart ROMANOWICZ, Nano Science & Technology Institute, Cambridge, USA
Benedetto VIGNA, STMicroelectronics, Cornadero, Italy
Thomas ZAHNER, OSRAM Opto Semiconductors, Germany
Ying-Zong JUANG, National Chip Implementation Center (CIC), Taiwan

Topics

The topics for this Conference include (preliminary):
Technology CAD in general
Modeling and simulation of fabrication processes
Devices and components (sensors, actuators, …)
MEMS/MOEMS libraries and IP
Signal processing
Integrated CAD tools
Numerical simulation
Yield estimation
Failure mechanisms
Fault modeling
Fault simulation and test pattern generation
Mechanical simulation
Thermal evaluation
Interoperability of CAD/CAE tools
Multiphysics simulation
Structured design methodologies
Languages for interchange data among designs and tools
Model order reduction