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Microfabrication, Integration and Packaging Conference

Chair: Reza GHODSSI, U. of Maryland, College Park, USA
Co-Chair: Hsiharng YANG, National Chung Hsing U., Taiwan

The Microfabrication, Integration and Packaging Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

Programme Committee: To include

Xuechuan SHAN, SIMTech, Singapore
Chris van HOOF, IMEC, Leuven, Belgium
Skandar BASROUR, TIMA Lab., Grenoble, France
Ryutaro MAEDA, MEMS and Packaging Research Group, AIST, Tsukuba, Japan
David ALLEN, Cranfield Univ., Bedford, UK
Zhenfeng WANG, Singapore Institute of Manufacturing Technology (SIMTech), Singapore
Chantal Khan MALEK, Lab. FEMTO-ST/LPMO, Besançon, France
Eng Hock TAY, National Univ. of Singapore
Juerg DUAL, ETH Zentrum, Zürich, Switzerland
Gou-Jen WANG from National ChungHsing Univ. in Taiwan
Masayoshi ESASHI, Tohoku Univ., Japan
Henri CAMON, LAAS, Toulouse, France
Yves-Alain PETER, EPM, Montréal, Canada
Bob PUERS, KU Leuven, Belgium
Wolfgang REINERT, Fraunhofer Institute for Silicon Technology, Itzehoe, Germany
Philippe RENAUD, EPFL, Lausanne, Switzerland
Bernd MICHEL, IZM, Berlin, Germany
Victor M. BRIGHT, Univ. of Colorado at Boulder, USA
Yuelin WANG, SIMIT, Shanghai, China
Kazuo SATO, Nagoya Univ., Japan
Andrew TAY, National Univ. of Singapore
Adrian IONESCU, EPFL, Lausanne, Switzerland
Alain BOSSEBOEUF, IEF, Paris-Orsay, France
Matthias WORGULL, FZK, Karlsruhe, Germany

Topics

The topics for this Conference include (preliminary):
Integrated processes (micromachining, micromolding, …)
Process integration between MEMS and electronics
Microlithography issues unique to MEMS/MOEMS
Manufacturing
Materials
Assembly technologies
Packaging for harsh environments
MOEMS packaging
RF and microwave packaging
Test structures
Devices and components (sensors, actuators, …)
Dimensional measurements
Physical measurements
Failure analysis
Reliability
Characterization
Process monitoring
Non destructive evaluation