Chair: Bernard COURTOIS, CMP, Grenoble, France
Co-Chair: Jean Michel KARAM, MEMSCAP, Bernin, France
 Rome, Italy 1-3 April 2009 |
SYMPOSIUM on
Design, Test, Integration & Packaging of MEMS/MOEMS |
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Aim
Presentations | Venue & Access | Contacts | Social event | Exhibition & Poster Information | Registration | Hotel accommodation | Technical program | Conferences | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |
Special session on 3D Integration of MEMS
The Special session on 3D Integration of MEMS puts together papers on demand for 3D-Integration, design support from the application point of view, 3D Integration technologies enabling stacking of MEMS, as well as application examples from different areas.
This special session is organized by Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany