Aim

Presentations | Venue & Access | Contacts | Social event | Exhibition & Poster Information | Registration | Hotel accommodation | Technical program | Conferences | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |

Contacts

Symposium Chair:
Bernard COURTOIS, CMP - Tel.: +33 4 76 57 46 15 - Fax: +33 4 76 47 38 14
Symposium Co-Chair:
Jean-Michel KARAM, MEMSCAP - Tel.: +33 4 76 92 85 00 - Fax: +33 4 76 92 85 10

CAD, Design and Test Conference:
Chair: Tarik BOUROUINA, ESIEE, Noisy-le-Grand, France
Co-Chair: Aurelio SOMA', Politecnico di Torino, Italy

Microfabrication, Integration and Packaging:
Chair: Reza GHODSSI, Univ. of Maryland, College Park, USA
Co-Chair: Hsiharng YANG, National Chung Hsing U., Taiwan

Local secretary: Chantal BENIS-MOREL, CMP - Tel.: +33 4 76 57 46 22 - Fax: +33 4 76 47 38 14