![]() Rome, Italy 1-3 April 2009 |
SYMPOSIUM on
Design, Test, Integration & Packaging of MEMS/MOEMS |
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Presentations | Venue & Access | Contacts | Social event | Exhibition & Poster Information | Registration | Hotel accommodation | Technical program | Conferences | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |
Christian A. ZORMAN, Case Western Reserve University, Cleveland, Ohio, USASilicon Carbide (SiC) is emerging as an enabling material for biomedical microsystems due to its unique combination of electrical, mechanical and chemical properties. This talk will review the latest advancements in this area including on-going research to develop SiC thin films for bio-microdevice packaging, bio-filtering, biomedical imaging and other related applications.
Michel BRILLOUET, CEA/LETI, Grenoble, FranceMoving from micrometer-scale microsystems to nanometer sized devices gives exciting new perspectives from a laboratory perspective: it is not just a matter of extending MEMS concepts to a smaller scale, but, owing to phenomena arising at these dimensions, the approach for designing new sensors has to be revisited. Potential technical breakthroughs will be first discussed. However the onset of new applications didn't materialize yet in the daily life: reasons for that and the way out towards emerging markets will be considered.