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CAD, Design and Test Conference

Chair: Peter SCHNEIDER, Fraunhofer IIS/EAS, Dresden, Germany
Co-Chair: Pascal NOUET, LIRMM, Montpellier, France

The CAD, Design and Test Conference will bring together researchers, engineers and practitioners involved in the development of CAD tools and design methodologies for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

• Jian ZHU, Nanjing Electronic Devices Institute, China
• Mahnaz SHAMSHIRSAZ, Amirkabir Univ. of Tech., Tehran, Iran
• Suzanne COSTELLO, Heriot Watt Univ., Edinburgh, UK
• Hisham HADDARA, Si-Ware Systems, Cairo, Egypt
• Marc DESMULLIEZ, Heriot-Watt Univ., Edinburgh, UK
• Shawn BLANTON, Carnegie Mellon Univ., Pittsburgh, USA
• Marta RENCZ, BUTE, Budapest, Hungary
• Gerhard WACHUTKA, Munich Univ. of Technology, Germany
• Francis PRESSECQ, CNES, Toulouse, France
• Robert RUDD, Lawrence Livermore National Lab. Livermore, USA
• Andrew RICHARDSON, Lancaster University, UK
• Tarik BOUROUINA, ESIEE, Noisy-le-Grand, France
• Franck CHOLLET, Femto-ST
• Yung C. LIANG, National Univ. of Singapore
• Patric SALOMON, 4M2C PATRIC SALOMON, Berlin, Germany
• Waleed FARIS, Int'l Islamic Univ. Malaysia, Malaysia
• Arturo AYON, Univ. of Texas at San Antonio, USA
• Bart ROMANOWICZ, Nano Science & Technology Institute, Cambridge, USA
• Anis Nurashikin NORDIN, Int' Islamic Univ, Kuala Lumpur, Malaysia
• Ray ROOP, Freescale Semiconductor, Inc., USA
• Thomas ZAHNER, OSRAM Opto Semiconductors, Germany
• Aurelio SOMA, Politecnico di Torino, Italy
• Gaelle LISSORGUES, ESIEE, Noisy-le-Grand, France
• Mark BEGBIE, iSLI, UK
• Gerold SCHROEPFER, Coventor, France
• Benoit CHARLOT, IES, Montpellier, France
• Souhil MEGHERBI, Univ. Paris Sud, France
• Romolo MARCELLI, CNR-IMM Roma, Italy
• Kazuhiro HANE, Sendai University, Japan
• Narayan R. ALURU, Univ. of Illinois Champaign, Urbana, USA
• Igor BALK, TDC LLC, USA
• Ash PARAMESWARAN, SFU, Canada
• Tamal MUKHERJEE, Carnegie Mellon Univ., Pittsburgh, USA
• Rainer LAUR, Univ. of Bremen, Germany
• Libor RUFER, TIMA Lab., Grenoble, France

Topics

The topics for this Conference include (preliminary):
Technology CAD in general
Modeling and simulation of fabrication processes
Devices and components (sensors, actuators, …)
MEMS/MOEMS libraries and IP
Signal processing
Integrated CAD tools
Numerical simulation
Yield estimation
Failure mechanisms
Fault modeling
Fault simulation and test pattern generation
Mechanical simulation
Thermal evaluation
Interoperability of CAD/CAE tools
Multiphysics simulation
Structured design methodologies
Languages for interchange data among designs and tools
Model order reduction