11-13 May 2011
Design, Test, Integration
& Packaging of MEMS/MOEMS
Presentations | Hotel / Venue & Access | Contacts | Social event | Poster Information | Registration | Panels | Technical program | Conferences: | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |
Modern MEMS sensors for automotive as well as consumer electronics face a continuous pressure for size reduction. This can be met not only by a consistent shrink of sensing elements and ASICs resulting in a smaller package but also through the integration of several sensors into one package. The trends and challenges of this steady shrink will be explained and several examples of current automotive and consumer MEMS sensors will be shown.
Rapid growth of MEMS society has been driven by development and commercialization of Deep Reactive Ion Etching (DRIE) technology. Remarkable increase in etch rate and new application of DRIE will be presented. Environmentally friendly technology introduced in DRIE as well as Wireless Sensor Network (WSN), new MEMS application contributing to green and health monitoring will also be discussed.