11-13 May 2011
Design, Test, Integration
& Packaging of MEMS/MOEMS
Presentations | Hotel / Venue & Access | Contacts | Social event | Poster Information | Registration | Panels | Technical program | Conferences: | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |
The technical programme included three panels.
This panel was co-organized by Jean-Michel KARAM, MEMSCAP, Bernin, France and by Jérémie BOUCHAUD, IHS iSuppli, Munich, Germany.
This panel was organized by Erik JUNG, Fraunhofer IZM, Berlin, Germany.
This panel was organized by Marc DESMULLIEZ, MISEC/Heriot-Watt Univ., Edinburgh, UK.