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Presentations | Hotel / Venue & Access | Contacts | Social event | Poster Information | Registration | Panels | Technical program | Conferences: | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |

Panels

View the DTIP2011 Program PDF)

The technical programme included three panels.

• Panel on High Added Value MEMS

This panel was co-organized by Jean-Michel KARAM, MEMSCAP, Bernin, France and by Jérémie BOUCHAUD, IHS iSuppli, Munich, Germany.

• Panel on Textile Microsystems

This panel was organized by Erik JUNG, Fraunhofer IZM, Berlin, Germany.

• Panel on Hermeticity in MEMS

This panel was organized by Marc DESMULLIEZ, MISEC/Heriot-Watt Univ., Edinburgh, UK.