Aim

Presentations | Hotel / Venue & Access | Contacts | Social event | Poster Information | Registration | Panels | Technical program | Conferences: | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |

program

View the DTIP2011 Program (.pdf)
View the Final Technical Program (.pdf)
At a glance(.pdf)

DTIP2011 technical program will include 67 oral talks, 18 poster presentations, 3 panels, 2 invited speakers and 2 special sessions.
REGULAR SESSIONS:

• Oral presentations:
  • Compact and Behavioural Modelling
  • Model Order Reduction
  • Modelling and Validation
  • Applications (I & II)
  • Fabrication and Packaging
  • Energy Harvesting
  • Sensors and Actuators
  • Embossing and Mould
  • Reliability, Testing and Measurement
• Poster presentations:
  • 18 posters - to be introduced by a 3 minutes oral talk in a plenary poster session.