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Microfabrication, Integration and Packaging Conference

Chair: Benoit CHARLOT, IES, Montpellier, France
Co-Chair: Ryutaro MAEDA, UMEMSME/AIST Tsukuba, Japan

The Microfabrication, Integration and Packaging Conference will bring together researchers, engineers and practitioners involved in the development of integration technologies and packaging for MEMS and MOEMS. The participants will also have the opportunity to interact with the other Conference by the means of plenary talks.

• Geok Ing NG, Nanyang Technological University, Singapore
• Mohamed HENINI, Univ. of Nottingham, UK
• Xuechuan SHAN, SIMTech, Singapore
• Masayoshi ESASHI, Tohoku Univ., Japan
• Gou-Jen WANG, National ChungHsing Univ., Taiwan
• Andrew TAY, National Univ. of Singapore
• David ALLEN, Cranfield Univ., Bedford, UK
• Reza GHODSSI, Univ. of Maryland, College Park, USA
• Zhenfeng WANG, SIMTech, Singapore
• Henri CAMON, LAAS, Toulouse, France
• Bernd MICHEL, Fraunhofer ENAS, Chemnitz, Germany
• Alain BOSSEBOEUF, IEF, Paris-Orsay, France
• Hsiharng YANG, National Chung Hsing Univ., Taiwan
• Wolfgang REINERT, Fraunhofer Institute for Silicon Technology, Itzehoe, Germany
• Yves-Alain PETER, EPM, Montréal, Canada
• Giancarlo BARTOLUCCI, Roma "Tor Vergata" University, Italy
• Toshihiro ITOH, AIST, Japan
• Emanuela PROIETTI, IMM Roma, Italy
• Susumu KAMINAGA, Sumitomo Precision Products Co., Ltd., Japan
• Matthias WORGULL, FZK, Karlsruhe, Germany
• Victor M. BRIGHT, Univ. of Colorado at Boulder, USA
• Jyh-Cheng (Jason) YU, Nat'l Kaohsiung 1st U. of Sc.& Tech., Taiwan

Topics

The topics for this Conference include (preliminary):
Integrated processes (micromachining, micromolding, …)
Process integration between MEMS and electronics
Microlithography issues unique to MEMS/MOEMS
Manufacturing
Materials
Assembly technologies
Packaging for harsh environments
MOEMS packaging
RF and microwave packaging
Test structures
Devices and components (sensors, actuators, …)
Dimensional measurements
Physical measurements
Failure analysis
Reliability
Characterization
Process monitoring
Non destructive evaluation