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Plenary invited speakers

Thomas W. KENNY, Stanford University, USA

"Using MEMS to build the Device and the Package"

There has been interest in MEMS Resonators for more than 40 years, including discussion of their use as frequency references. Unfortunately, the performance of MEMS resonators for these applications has always been limited by drift in frequency, which comes from the temperature coefficient of the modulus of Silicon, as well as the role of adsorbed molecules from the environment of the resonator and other nefarious effects. The presentation will discuss a wafer-scale MEMS encapsulation process that enables a solution to many of these problems with MEMS resonators.

Masayoshi ESASHI, Tohoku University, Japan

"Integrated MEMS using adhesive bonding and other methods"

Integrated MEMS for multiband wireless systems and so on have been developed by wafer level bonding of MEMS structures as filters and switches on LSI.

Martin DETERRE, Sorin Group, France

"MEMS integration for smart medical devices: opportunities and challenges"

In the insatiable quest for miniaturization, improved performance, novel sensing and treatment capabilities, implantable medical devices are now required to integrate micro-nano systems. As they enter the biomedical world, MEMS are facing new challenges such as biocompatibility, perpetual reliability and extended life span. The talk will discuss how these disciplines are now converging to broaden the scope of perspectives for healthcare devices, paving the way to innovative treatments and life-improving implantable smart sensors.