16-18 April 2013
Design, Test, Integration
& Packaging of MEMS/MOEMS
Paper presentation | Reviewer access | Hotel / Venue & Access | Contacts | Social event | Registration | Technical program | Conferences: | CAD, Design and Test Conference | Microfabrication, Integration and Packaging Conference | Invited Speakers Special Sessions Past events |
The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
Bernard COURTOIS & Jean-Michel KARAM