dtip
Barcelona, Spain
16-18 April 2013
SYMPOSIUM on

Design, Test, Integration
& Packaging of MEMS/MOEMS
collage
DTIP13 kdo_bc

The Organizing Committee thanks the participants from 21 countries for their contributions to the programme and ambiance of DTIP 2013!

The Symposium is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP.
Bernard COURTOIS & Jean-Michel KARAM