0.35µm Active Silicon Interposer with UBM

3D IC ams 0.35µm Si-Interposer 4 ML Active Silicon Interposer with UBM

TECHNOLOGY CHARACTERISTICS :

Guaranteed minimum delivered pieces: 40.
ams C35 standard backend: 4 metal layers (3 + 1 Thick).
Active layers available for CMOS integration.
Frontside UBM Ni/Pd/Au deposited at PacTech.
Size limit for submitted design is 200 mm2, for design > 200 mm2 please contact CMP.

APPLICATION AREA :

Active Silicon Si-Interposer

DESIGN KIT VERSION :

ams C35B4 4.10

LIBRARIES :

ams C35B4 libraries