MEMS Specific MEMS technologies PolyMUMPs

MEMS MEMSCAP Specific MEMS technology MEMS MUMPS PolyMUMPs

TECHNOLOGY CHARACTERISTICS :

Fixed die size: 1cm x 1cm
Polysilicon/gold
Surface micromachining

SPECIAL FEATURES :

Polysilicon Surface Micomachining. One poly ground layer, two structural poly layers, one gold metal layer, two oxide release layers.

APPLICATION AREA :

MEMS, micromechanics, MOEMS.

DESIGN KIT VERSION :

1, MEMS Pro v7.0

Frontend Backend tools :

Cadence IC 6.1.5 Cadence IC 5.1.41 SoftMEMS: Datasheet Softmems_filesmpv70_ds_hq.

Verification tools :

Calibre (Mentor Graphics)

LIBRARIES :

CaMEL (Consolidated Micromechanical Element Library: http://www.memscap.com/memsrus/svcscml.html). CaMEL contains a non-parameterized cell database and a parameterized MEMS element library, for use by both the novice and advanced MEMS designers. Both libraries are intended to assist users in the design and layout of MEMS devices by providing an initial layout for components of a MEMS system.

TURNAROUND TIME :

Typical leadtime: 10 weeks from MPW run deadline to packaged parts