MEMS Integrated Design for Inertial Sensors (MIDIS TM).
1cm Die size: From 16mm² to 64mm²
The MIDIS TM Platform is being offered as Multi-Project-Wafer (MPW) service through CMC Microsystems.
Getter-free high-vacuum sealing allows resonator Q factors > 20,000. Efficient wafer-level packaging minimizes overall die size. 1.5 µm feature size in a 30 µm thick membrane. Comb height control allows out-of-plane sensing. TSV allows compact design ready for co-packaging.
Accelerometers Gyroscopes Resonators Inertial sensor combos (Sensor fusion)
Conventor Catapult (Designer) from CoventorWAreTM Cadence IC 6.1.5 ANSYS
Typical: 15 weeks (from GDS2 tape to packaged parts)