Passive Silicon Interposer with UBM

3D IC ams Si-Interposer 4 ML Passive Silicon Interposer with UBM

TECHNOLOGY CHARACTERISTICS :

Guaranteed minimum delivered pieces: 40
ams CMOS C35 standard backend: 4 metal layers (3+1 Thick).
Metal stack only (no active devices integrated).
Frontside UBM Ni/Pd/Au deposited at PacTech.
Size limit for submitted design is 400 mm2.
Dedicated runs can be made available at any time.
For design < 150 mm2, further cost reduction may be applicable under condition.
Please contact CMP.

APPLICATION AREA :

Passive Silicon Si-Interposer

DESIGN KIT VERSION :

ams C35B4 4.10

LIBRARIES :

ams C35B4 libraries