Guaranteed minimum delivered pieces: 40
ams CMOS C35 standard backend: 4 metal layers (3+1 Thick).
Metal stack only (no active devices integrated).
Frontside UBM Ni/Pd/Au deposited at PacTech.
Size limit for submitted design is 400 mm2.
Dedicated runs can be made available at any time.
For design < 150 mm2, further cost reduction may be applicable under condition.
Please contact CMP.
Passive Silicon Si-Interposer
ams C35B4 4.10
ams C35B4 libraries