Events :: CMP Seminar @ DATE 2011
Slides presented to the CMP Seminar @ DATE 2011, 17 March 2011 in Grenoble:
- Agenda
- Introduction, presentation of the Seminar
- IC processes from Austriamicrosystems
- IC processes from STMicroelectronics
- MEMS processes from MEMSCAP and from Bulk-micromachining
- Design Kits and Libraries
- Packaging
- Distribution of Design Kits
- Checking before manufacturing
- IP Overview
- ARM tools and cores (E. Lalardie – ARM)
- Evatronix IPs (C. Elgert – Evatronix)
- 130nm 3D-IC process from Tezzaron
- 3D tools (P. Dos Santos, J.F. Lepere – Cadence)
- 20nm FDSOI from CEA-Leti (C. Reita – CEA-Leti)
- 150nm GaAs from TriQuint
- Magnetic-CMOS circuits
- Powering ICs and MEMS with PV/OPV (C. Landrock – I|D|ME)
- 180nm CMOS from Tower for power, BCD, CIS (F. Riedlberger – Tower)
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