News :: Archives
STMicroelectronics: HCMOS9/BiCMOS9/H9-SOI runs: Postponed to the 10 May 2013
Fri, 05 Apr 2013 15:43:00 GMT
ST has delayed the following runs:
- S13C13_2/S13S13_2/S13I13_2: from 17 April to 10 May.
STMicroelectronics Makes Leading-Edge MEMS Technology Available for Prototyping through CMP
Tue, 19 Mar 2013 09:00:00 GMT
STMicroelectronics and CMP today announced that ST's THELMA MEMS manufacturing process, the process ST uses for its industry-leading accelerometers and gyroscopes, which have shipped in billions of units, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
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STMicroelectronics Makes Analog 130nm H9A CMOS Process Available Through CMP
Thu, 07 Mar 2013 15:00:00 GMT
STMicroelectronics and CMP today announced that ST's CMOS H9A process (at 130nm lithography node), which offers a large panel of analog and digital devices, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
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Latest annual meeting: 17 January 2013
Tue, 26 Feb 2013 14:35:00 GMT
The annual CMP users meeting took place on 17 January 2013 in Paris at ASIEM.
See the slides presented during the meeting.
STMicroelectronics in Cooperation with Soitec Makes 28nm FD-SOI CMOS Process Available Through CMP
Thu, 18 Oct 2012 15:03:00 GMT
STMicroelectronics, Soitec and CMP today announced that ST's CMOS 28nm Fully Depleted Silicon-On-Insulator (FD-SOI) process, which uses innovative silicon substrates from Soitec, is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
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S28C12_5 putted forward to November the 19th
Tue, 04 Sep 2012 15:14:00 GMT
ST has putted forward the S28C12_5 run of 2 weeks. Deadline is now November the 19th.
STMicroelectronics: HCMOS9/BiCMOS9 runs: changed dates
Wed, 14 Mar 2012 16:30:00 GMT
ST has delayed the following runs:
- S13C12_2/S13S12_2/S13I12_2: from 24 April to 2 May
- S13C12_3/S13S12_3/S13I12_3: from 4 July to 11 July
Latest annual meeting: 25 January 2012
Tue, 28 Feb 2012 15:55:00 GMT
The annual CMP users meeting took place on 25 January 2012 in Paris at ASIEM.
See the slides presented during the meeting.
CMP is now offering Obsidian Technology IPs
Mon, 26 Sep 2011 09:32:00 GMT
The silicon Intellectual Property (IP) provider, Obsidian Technology and CMP (Circuits Multi Projects®), announced their collaboration and development of an educational program by including the distribution of the portfolio of Obsidian Intellectual Property (IP) for Universities and Research Laboratories and companies.
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CMP Chooses I|D|ME Organic Solar Cell Technology for Integration with CMOS
Wed, 29 Jun 2011 10:36:00 GMT
I|D|ME Development Corp., an emerging leader polymer based electronic design and fabrication, and Circuits Multi-Projects (CMP) announce CMP has chosen I|D|ME's proprietary ultra-stable Organic (polymer) Photovoltaic Cells (OPVs) for universities, research labs and small company customers.
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STMicroelectronics Makes 28nm CMOS Process Available Through CMP
Wed, 15 Jun 2011 14:51:00 GMT
STMicroelectronics (NYSE:STM) and CMP (Circuits Multi Projets®) today announced that the CMOS 28nm process from STMicroelectronics is now available for prototyping to universities, research labs and companies through the silicon brokerage services provided by CMP.
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CMP Seminar @ DATE 2011
Wed, 23 Mar 2011 09:55:00 GMT
CMP Seminar @ DATE 2011 took place on 17 March 2011 in Grenoble.
See the slides presented during the seminar.
CMP Selects TowerJazz's Advanced Power Management and CMOS Image Sensor Processes and PDKs to Meet Growing Customer Demand
Wed, 16 Mar 2011 09:10:00 GMT
TowerJazz, the global specialty foundry leader, today announced that its advanced 0.18 micron power management and CMOS image sensor (CIS) technology and sophisticated process design kits (PDKs) are now available for prototyping to companies, universities and research labs through the services provided by CMP.
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Latest annual meeting: 20 January 2011
Fri, 11 Feb 2011 14:11:00 GMT
The annual CMP users meeting took place on 20 January 2011 in Paris at ASIEM.
See the slides presented during the meeting.
CMP Chooses TriQuint as its Gallium Arsenide Foundry Services Partner
Thu, 27 Jan 2011 13:20:00 GMT
TriQuint Semiconductor, Inc (NASDAQ: TQNT), a leading RF front-end product manufacturer and foundry services provider, and Circuits Multi-Projects (CMP) announce CMP has chosen TriQuint's TQP15 for its Gallium Arsenide foundry process technology offering for universities and small company customers.
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65nm PDK for Tanner Tools available from CMP
Wed, 05 Jan 2011 15:59:00 GMT
CMP announce it has released the Tanner® Process Design-Kit (PDK) for the 65nm CMOS process it offers.
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STMicroelectronics : hcmos9/bicmos9mw runs are scheduled
Mon, 06 Dec 2010 16:21:00 GMT
Dates for HCMOS9GP/HCMOS9-SOI/BICMOS9MW runs are scheduled. Please check our 2011 schedule.
Special Session at the 3DIC Conference: Manufacturing Service on 3D ICs
Wed, 24 Nov 2010 11:00:00 GMT
CMC/CMP/MOSIS are partnering to offer a 3D-IC MPW service based on Tezzaron's SuperContact technology and GLOBALFOUNDRIES 130nm CMOS.
The first MPW run is targeting May 2011:
- 2-tier face-to-face bonded wafers
- 130nm CMOS process for both tiers
- Top tier exposing TSV and backside metal pads for wire bonding.
A design-kit supporting 3D-IC design with standard-cells and IO libraries is available.
Further MPW runs will be scheduled supporting process flavors (multiple tiers beyond 2, different CMOS flavors for different tiers, ...) driven by user requirements.
CMC/CMP/MOSIS have organized a special session at the IEEE 3D System Integration Conference 2010 (3DIC) in Munich to present the MPW service.
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CEA-Leti Makes a R&D 20nm Fully Depleted SOI Process available through CMP
Fri, 01 Oct 2010 08:01:00 GMT
CEA-Leti and CMP announced during the FDSOI Workshop at Tokyo Universitythe launch of an Exploratory MPW initiative based on FDSOI 20nm process, opening the access of its 300mm infrastructure to the design community. This MPW offer is partly supported by EUROSOI+ network that gathers the main European academic partners on SOI.
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CMP/CMC/MOSIS partner to introduce a 3D-IC process
Tue, 22 Jun 2010 09:22:00 GMT
CMP/CMC/MOSIS are partnering to offer a 3D-IC MPW service based on Tezzaron's SuperContact technology and GLOBALFOUNDRIES 130nm CMOS.
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HCMOS9/BiCMOS9MW runs are set for the second semester
Fri, 14 May 2010 15:41:00 GMT
STMicroelectronics has set dates for HCMOS9/BiCMOS9MW runs in the second semester. Please check our time table.
CMP introducing CMOS 0.35µm Bulk Micromachining MEMS
Tue, 16 Mar 2010 11:27:00 GMT
CMP announce the introduction of of CMOS 0.35µm Bulk Micromachining MEMS, Micro Electro Mechanical Systems, available from CMP. This process will enable the fabrication of devices such as radio frequency (RF) MEMS communication systems, suspended plates, bridges, cantilevers, for IR or temperature detection, gaz flow detection and metering, piezo-resistive applications, and more ...
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CMP announce the 130nm SiGe BiCMOS process from STMicroelectronics being available from CMP
Tue, 16 Mar 2010 10:58:00 GMT
The process code name is BICMOS9MW. It is using the well known HCMOS9, 130nm CMOS, as a base process. Existing designers using the bulk 130nm can migrate easily their CMOS IPs to this BICMOS9MW process.
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Latest annual meeting: 28 January 2010
Tue, 02 Mar 2010 14:38:00 GMT
The annual CMP users meeting took place on 28 January 2010 in Paris at ASIEM.
Slides are available.
S13C10_1 postponed to February the 10th
Tue, 22 Dec 2009 10:52:00 GMT
ST has postponed the run. The new dead line for submission of circuits is February the 10th.
S65C09_4/S65I09_4 delayed to 2009/12/09
Mon, 30 Nov 2009 10:21:00 GMT
ST has delayed the CMOS065 runs of november. The new deadline is Wednesday December the 9th.
S90C9_2: last run in CMOS090
Thu, 28 May 2009 11:19:00 GMT
Prototyping runs are stopping in CMOS090 technology of ST. The S90C9_2 run will be the last run.
The S90C9_3 run is canceled.
Latest annual meeting: 15 January 2009
Mon, 19 Jan 2009 15:31:00 GMT
The annual CMP users meeting took place on 15 January 2009 in Paris at ASIEM.
Slides are available
S13C9_3, S13I9_3, S13C9_4 and S13I9_4: dates have changed
Thu, 08 Jan 2009 11:07:00 GMT
2009/01/08
Dates of the following runs have changed:
- S13C9_3, S13I9_3: 2009/07/08
- S13C9_4, S13I9_4: 2009/09/23
ICM 08 Keynote speaker: Bernard Courtois
Fri, 05 Dec 2008 12:06:00 GMT
Integrated Circuit Brokers: Where do they come from? Where are they heading?
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The first ED02AH run of 2009 is scheduled
Thu, 04 Dec 2008 11:34:00 GMT
The First ED02AH run of 2009 is scheduled. OMMIC should shedule a second in Q2 2009. We will add it as soon as we are informed.
CMOS090 runs of 2009 are scheduled
Thu, 04 Dec 2008 11:32:00 GMT
3 CMOS090 runs are scheduled in 2009, please check the run table.
Fabricating a Prototype
Fri, 28 Nov 2008 14:34:00 GMT
Fabricating a Prototype by Bernard Courtois on IEEE TV
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Interview of Bernard Courtois
Mon, 23 Jun 2008 14:30:00 GMT
Interview of Bernard Courtois by Mobil Word TV, Kuala Lumpur, 2008
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STMicroelectronics 130nm SOI Process available
Wed, 21 May 2008 10:56:00 GMT
Grenoble, France, March 7th, 2008 - CMP today announce the 130nm SOI from STMicroelectronics being available from CMP.
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STMicroelectronics 65nm SOI Process available
Wed, 21 May 2008 10:51:00 GMT
Grenoble, France, March 7th, 2008 - CMP today announce the 65nm SOI from STMicroelectronics being available from CMP.
Read more
ED02AH: New design Manual + new design kits
Wed, 06 Feb 2008 13:13:00 GMT
The ED02AH design Manual have been updated by OMMIC, it contains new versions of design kits for ADS and for AWR. OMMIC customers can request it to Sylvaine Eyraud.
Latest annual meeting: 10 January 2008
Mon, 21 Jan 2008 09:27:00 GMT
The annual CMP users meeting took place on 10 January 2008 in Paris at ASIEM.
See the slides presented during the meeting.
CMP Introducing 45nm CMOS Process
Thu, 03 Jan 2008 13:49:00 GMT
CMP, today announces the introduction of the 45nm CMOS design plaform for next-generation product development for low-power, wireless and portable consumer applications, available from CMP.
Read more (PDF)
CMP introducing ASIMPS mems process from CMU based on BiCMOS from STMicroelectronics
Tue, 20 Nov 2007 13:57:00 GMT
CMP announces the introduction of the ASIMPS MEMS process from Carnegie Mellon
University (CMU). The process is available from CMP on top of the BICMOS7RF 0.25 micron SiGe process from STMicroelectronics.
Read more.
CMP Introducing 65nm CMOS Process
Sat, 11 Nov 2006 16:07:00 GMT
CMP Introducing the Access to 65nm CMOS Process from STMicroelectronics.
[Press Release (PDF)]
18 January 2007: Annual users meeting
Thu, 09 Nov 2006 10:02:00 GMT
The annual CMP users meeting took place on 18 January 2007 in Paris. The meeting gathered more than 80 people from Universities, Industry and ministry (MEFI). See the slides presented during the meeting.
CMP and ICC to team up
Mon, 26 Jun 2006 14:17:00 GMT
CMP, Circuits Multi-Projets®, based in Grenoble, France and ICC, Shanghai Research Center for Integrated Circuit Design, based in Shanghai, China, today announced that they will team up to better serve their respective customers. See the press release.
Cooperation with SVTI
Fri, 19 May 2006 16:21:00 GMT
Silicon Valley Technical Institute® (SVTI) Signs Memorandum of Understanding with the Circuits-Multi-Projects® (CMP) Organization of France.
Agreement Boosts Semiconductor Manufacturing & Packaging Capability of SVTI Educational Programs Worldwide. See the Press release.
13 January 2006: Annual users meeting
Fri, 20 Jan 2006 13:31:00 GMT
The annual CMP users meeting took place on Friday 13 January 2005 in Paris at ASIEM.
About 80 people attended the meeting. See the slides presented during the meeting.
CMP, ARM extend licensing to include ESL Tools.
Mon, 16 Jan 2006 16:42:00 GMT
ARM [(LSE: ARM); (Nasdaq: ARMHY)] today announced that
Circuits-Multi-Projects (CMP) has licensed the ARM® RealView® CREATE family of Electronic System
Level (ESL) tools to drive advanced SoC projects in universities and research laboratories across
Europe, Turkey, Egypt and Israel. Read more (PDF)
32 designs fabricated through CMP 90nm cmos process from STMicroelectronics.
Mon, 16 Jan 2006 16:03:00 GMT
CMP announce that 32 designs from 14 customers have been processed this year in CMOS090 90nm CMOS process from STMicroelectronics. Read more (PDF)
CMP prices for 2006
Fri, 06 Jan 2006 16:01:00 GMT
CMP prices for 2006 are available here.
Some minimum charges and pricing are changed.
Press: EETimes Online: ARM, CMP extend licensing to include ESL tools
Wed, 04 Jan 2006 09:44:00 GMT
Download file here
CMP annual users meeting : 13 January 2006 in Paris
Mon, 02 Jan 2006 11:55:00 GMT
The annual CMP users meeting will take place on Friday 13 January 2005 in Paris at ASIEM. More information
ARM invites you to its one day Symposium, Nov 17th in Paris
Wed, 12 Oct 2005 10:04:00 GMT
ARM is pleased to invite you to the 2005 ARM Connected Community Technical Symposium to be held on November 17th in Paris. A lot of information and ARM solutions will be presented during this symposium.
CMP and TIMA Laboratory will participate in this symposium. An experiment from TIMA Lab using new ARM ESL tools MAXSIM to build MPSoC with several ARM cores will be presented.
More information.
ED02AH: the new design manual, version of July 2005, in available
Wed, 28 Sep 2005 10:10:00 GMT
28 September 2005: the version of July 2005 of the design manual in ED02AH technology is now available. Official contacts can request it to cmp@imag.fr.
CMOS090 of STMicroelectronics: the 1.8v option is no longuer supported
Wed, 28 Sep 2005 10:00:00 GMT
STMicroelectronics informed us that the 1.8v option (layer OD_18 in the design kit) is no longuer supported in the CMOS090 technology.
0.6 CMOS CUP : last run in this technology
Tue, 23 Aug 2005 09:20:00 GMT
The last MPW 0.6 CMOS run (austriamicrosystems, CUP process) will be the run scheduled on
25 November 2005. No MPW 0.6 CMOS run will be organized in 2006.
Note that dedicated 0.6 CMOS runs will still be possible in 2006. Contact CMP in case you are interested in a dedicated run.
Seminar on MMIC Design Techniques
Thu, 23 Jun 2005 11:26:00 GMT
OMMIC organises a 3.5 days Seminar on MMIC Design Techniques from 19th to 22nd September 2005, in Limeil Brevannes, near Paris. See information on this training and the registration form.
CMP Annual Report 2004 is online
Mon, 20 Jun 2005 11:18:00 GMT
CMP Annual Report 2004 is online. See the About Us section
HCMOS9GP: MIM option in every runs
Tue, 14 Jun 2005 17:19:00 GMT
Since the S12C5_4 run, the MIM option is present in every HCMOS9GP runs. The new standard thickness for chips is now 375µm.
Last run 0.8 BiCMOS austriamicrosystems
Fri, 27 May 2005 09:32:00 GMT
The last prototyping run 0.8 BiCMOS austriamicrosystems will take place on 26 June 2005. Contact CMP as soon as possible if you want to participate.
Tanner Design Kit for 0.35 CMOS
Fri, 08 Apr 2005 16:27:00 GMT
CMP distributes since February 2005 the Version 2 of the Tanner Design Kit for
austriamicrosystems 0.35 CMOS (C35B4C3) process and libraries.
See the presentation and slides on this design-kit.
Ordering the design kit
CMP ships the first CMOS 90 nm circuits
Thu, 07 Apr 2005 14:27:00 GMT
Grenoble, April 2005 :CMP announced that the first CMOS 90 nm circuits are being shipped (to Berkeley and ETH Zurich). CMP introduced the CMOS 90 nm from STMicroelectronics in 2004. See the Press release in "About Us".
Technical Seminar OMMIC/ED02AH on 18-21 April
Tue, 05 Apr 2005 11:56:00 GMT
OMMIC organize a technical seminar on 18-24 April 2005. Courses are intended for customers who wish work with OMMIC processes for low noise, power, control functions as well as mixed signal applications.
information: contact J-F Paillotin.
0.35µm CMOS-Opto Process from austriamicrosystems only with 4 metal layers option
Tue, 15 Mar 2005 08:47:00 GMT
austriamicrosystems changed the available options of 0.35µm CMOS-Opto Process.
Starting from March 2005, only 4 - Metal layer version will be available for prototyping and/or production.
Since Chemical Mechanical Poolishing is performed between all metal levels, the surface of the process with 4 metal layers is as smooth as the process with 3 metal layers and the optical properties are therefore very similar.
February 2005: 0.8µm BiCMOS BYQ in 2005
Thu, 17 Feb 2005 16:33:00 GMT
One MPW run is scheduled on June 27th 2005, and will be confirmed one month before (end of May).
January 2005: CMOS ST processes open to Industrial Circuits
Tue, 25 Jan 2005 14:02:00 GMT
From January 2005 all the STMicroelectronics processes offered by CMP are open to Industrial Companies.
0.8 CMOS CYE and 0.8 BiCMOS BYQ in 2005
Tue, 25 Jan 2005 13:07:00 GMT
The process CYE (0.8um CMOS) from austriamicrosystems is phased out, and there is no possibility to fabricate designs issued with this technology, for prototyping, nor for production.
The process BYQ (0.8um BiCMOS) from austriamicrosystems has been stopped for prototyping in MPW runs. There are still possibilities to fabricate engineering runs (mono-projet runs), or productions. Contact CMP if you need to have such fabrications.
Consequently to those processes stopping, CMP is no longer offering the Bulk-Micromachining MEMS process for these two technologies.
12 January 2005: Annual users meeting
Thu, 13 Jan 2005 10:00:00 GMT
The annual CMP users meeting took place on Wednesday 12 January 2005 in Paris at ASIEM. The slides shown during the annual users meeting can be seen and downloaded.
Price of 0.12 CMOS STMicroelectronics decreases from 1 January 2005
Sat, 01 Jan 2005 10:00:00 GMT
Price of 0.12 CMOS STMicroelectronics is 2500 E/mm2 from 1 January 2005 instead of 2990 E/mm2 previously. See the pricelist
RSS Feed
Tue, 19 Oct 2004 15:30:00 GMT
The RSS feed is now available from this adress: http://cmp.imag.fr/news/rss.php. You now have the possibility to get every news in real time, with a XML file. You can use a RSS Agregator program to get these news.
Minimum charge for 0.12µ CMOS STMicroelectronics.
Mon, 01 Mar 2004 12:00:00 GMT
From 1 March 2004 the minimum charge for 0.12µ CMOS STMicroelectronics is 1 mm2 (instead of 2 mm2 previously). See the pricelist
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