Flip-Chip assembly

Flip-Chip assembly


Flip-Chip assembly

Flip-Chip assembly

Silicon chips can be assembled by Flip-Chip on a substrate (ceramic/Plastic) or directly to PCB. The choice of subcontractors as well as the choice of assembly technique (mass reflow, thermocompression, thermosonic…) depends on the type of chip, interconnect and substrate used in the project. You must request a quotation at the early stage of your project.

Check the “process catalog” section for more information on Flip-Chip interconnection realization.


Leadframe diagram