Silicon-on-Silicon assembly

Silicon-on-Silicon assembly


Silicon-on-Silicon assembly

Silicon-on-Silicon assembly

Silicon-on-Silicon assembly allow chip stacking for 2.5D/3D applications. Two silicon chips can be assembled together, or multiple chips can be assembled on top of Interposer (Silicon or Si-Photonics). Please contact CMP at the early stage of your project for a feasibility study/quotation.

Check the “process catalog” section for more information on OPEN3D post processes allowing 3D interconnection realization.


Leadframe diagram