CMP proposes a lot of technologies in CMOS, BiCMOS, SiGe BiCMOS, P-HEMT GaAs for ICs manufacturing in prototyping and low volume.
CMP provides two types of MEMS technologies for prototyping : Integrated bulk micromachining technologies and specific surface micromachining technologies.
CMP offers a complete assembly service based on a wide range of ceramic and plastic packages for prototypes and low volume production.
CMP distributes the design rules for each technology and the standard cell libraries for each specific software tool (design kits).
CMP has signed agreements with several CAD tools vendors in order to distribute the tools to Universities, Research Laboratories or Industry.
CMP may provide contacts with different test houses.
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HPGL Viewer and Raster available at www.softwarecompanions.com
Free GDSII Viewer: contact firstname.lastname@example.org
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