Products :: IC's Manufacturing

Technologies

1.Integrated Circuits
0.18 mic C18 CMOS 6LM ams
0.18 mic H18 High Voltage CMOS 6LM ams
0.35 mic C35B4C2 CMOS DLP/4LM 3.3V ams
0.35 mic C35B4C3 CMOS DLP/4LM 3.3V/5.0V ams
0.35 mic C35B4O1 CMOS-Opto DLP/4LM ams
0.35 mic C35B4M3 CMOS DLP/4LM ThickM4 & MIM ams
0.35 mic H35B4D3 CMOS DLP/4LM High Voltage ams
0.35 mic C35B4E3 CMOS DLP/4LM EEPROM / Flash ams
0.35 mic S35D4M5 SiGe BiCMOS DLP/4LM ams
28 nm FDSOI CMOS28FDSOI FDSOI 10LM STMicroelectronics
28 nm CMOS28LP CMOS 10LM STMicroelectronics
40 nm CMOS040 CMOS 7LM STMicroelectronics
65 nm CMOS065 CMOS 7LM STMicroelectronics
65 nm CMOS065-SOI SOI 6LM STMicroelectronics
130 nm HCMOS9GP CMOS 6LM STMicroelectronics
130 nm HCMOS9A HV-CMOS 4LM STMicroelectronics
130 nm BiCMOS9MW SiGe BiCMOS 6LM STMicroelectronics
130 nm HCMOS9-SOI SOI 6LM STMicroelectronics
0.15 mic TQP15 GaAs Dmode p-HEMT 2LM TriQuint SEMICONDUCTOR
2. Micro Electro Mechanical Systems (MEMS)
THELMA THELMA STMicroelectronics
PolyMUMPs PolyMUMPs MEMSCAP
SOIMUMPs SOIMUMPs MEMSCAP
MetalMUMPs MetalMUMPs MEMSCAP
Bulk Micromachining CMOS DLP/4LM + Post Process ams + Post Process
3. 3D Integrated Circuits (3D-IC)
130nm CMOS FaStack 130nm 2 Tiers 3D-IC Tezzaron/GlobalFoundries

Notes:

  1. Compatible front side Bulk Micromachining.
    Design rules are available.

Schedule

Prices

Low Volume Production

CMP can handle, in cooperation with the silicon vendors, low volume production i.e. approximately from some dozens to some thousands pieces.
Chips are normally untested and delivered packaged or not.
If tested chips are required, CMP will help the customer to choose a testing house responding to the test specifications.
To get a quotation from CMP, send the following information about your circuit:

  • technology
  • X and Y dimensions
  • CAD tool used for the design
  • standard cell library used
  • package type
  • number of untested chips (packaged and not packaged)
  • when was the circuit prototyped (CMP run and circuit name) ?