Products :: IC's Manufacturing :: Bulk Micromachining
Technology
0.35 µm Bulk Micromachining.
Die size:
Minimum charge of 3 mm²
Special Features
0.35 µm CMOS process from ams + TMAH post process etching
No additional mask for the MEMS post process
Bulk Micromachining announcement
Application Area
MEMS, micromechanics, MOEMS.
Design Kits
Workstation based: CADENCE, MENTOR GRAPHICS, SYNOPSYS
PC based: TANNER
CMP provides a CAD Tool for MEMS design : SoftMEMS
Packaging
Ceramic standard packages (DIL, LCC, PGA,...).
No plastic package. Special prices (upon request).
Test
Contact CMP
Interface format
GDSII
DRC
CADENCE
Design Support
Only DRC checking (free for submitted designs).
Prices
Design kits: Distributed for free by CMP
Prototyping: See the general CMP price list for prototyping
Low volume production: Depends on each specific case; contact CMP
Turnaround Time
Typical: 14 weeks (from GDS2 tape to naked dies).
Address Services and Contact
Azedine MANAA
Ph.: +33 4 76 57 46 21
Fax: +33 4 76 47 38 14
CMP
46 Av. Félix Viallet
38031 GRENOBLE Cedex
France
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