Products :: IC's Manufacturing :: MEMSCAP MetalMUMPs
Technology
MetalMUMPs from MEMSCAP.
Fixed die size:
1cm x 1cm
Special Features
Electroplated nickel surface micromachining process, thick layers.
Further information :
MetalMUMPs overview
MetalMUMPs datasheet
MEMSCAP web site
Application Area
MEMS, micromechanics, MOEMS
Design Kits
Workstation based: CADENCE, MENTOR GRAPHICS
PC based: TANNER
CMP provides a CAD Tool for MEMS design : SoftMEMS
Packaging
Ceramic standard packages (DIL, LCC, PGA,...).
No plastic package. Special prices (upon request).
Hybrid packaging possible (IC and MEMS in the same package).
Test
Contact CMP
Interface format
GDSII
DRC
CADENCE
Design Support
Only DRC checking (free for submitted designs)
Prices
Cell libraries: Distributed for free by CMP
Design kits: Distributed for free by CMP
Prototyping: See the general CMP price list for prototyping
Low volume production: Depends on each specific case; contact CMP
Turnaround Time
Typical: 10 weeks (from GDS2 tape to naked dies).
Address Services and Contact
Azedine MANAA
Ph.: +33 4 76 57 46 21
Fax: +33 4 76 47 38 14
CMP
46 Av. Félix Viallet
38031 GRENOBLE Cedex
France
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