Products :: IC's Manufacturing :: Prices

Generalities -- Flyer (from Fev-15)

Price per mm2 of the current price list is for 25 bare dies except for MEMSCAP, Open 3D, Teledyne DALSA.
Additional dies are charged.


DRC

Price includes DRC checking made by CMP before fabrication.
In case of DRC errors CMP will contact you for corrections.
Send your circuit layout before the deadline to have time for corrections.


Charged area

There is a minimum charge for each circuit depending on the technology process. This charge is defined as a minimum area.
Excepted for MEMSCAP the charged area includes a seal ring of 60µm added by CMP around the circuit (120µm added in X and in Y axis).

For 28nm advanced technologies, a price per block has been defined. Blocks are 2x2mm2 fixed size including seal ring of 120µm. The effective design surface is therefore 1.88 x 1.88mm2. Blocks can be associated next to each other to enlarge the design surface. Ex : for 4x2mm2, the effective design surface is :3,88 x 1,88mm2.


Examples for circuits in C35B4C3 technology of ams

  • The circuit size is 1500µm x 1600µm (limit of pad ring), you are charged of the minimum area, 3.43mm2 (including scribe).
    3.43mm2 * 650 Euro/mm2 = 2230 Euro.
  • The circuit size is 3000µm x 3000µm (limit of pad ring), you are charged of:
    (3000µm + 120µm) * (3000µm + 120µm) = 9.73mm2.
    9.73mm2 * 650 Euro/mm2 = 6325 Euro.

Packaging

Packaging must be ordered in the CMP Order Form before the deadline of the run.
The bonding diagram must be sent with the CMP Order Form.
Please check technical constraints on pad ring and price list and possible additional fees.


Additional circuits

Low volume (<100) of additional circuits can be ordered at any time as a function of availabilities. Large volume (>300) of additional circuits must be ordered before the deadline. Please contact us for precise estimates. Prices are determined on a case per case basis.


Colour plots

Colour plots must be ordered before the deadline. Default format is around A0 (115cm x 76cm).
Price: 40 Euro for the first sample and 25 Euro per copy.


Shipment fees

Depending on destination shipment fees for circuits and for plots are charged with an amount of 60 Euro to 150 Euro.

Design Kits, Libraries & support

Management and main data: CMP distributes the design rules for each technology and the standard cell libraries for each specific software tool (design kits). CMP handles about 40 different design kits (corresponding to different technologies and different CAD tools), which are sent to customers upon signature of a Confidentiality and License Agreement. Design kits are sent free of charge.
CMP staff members provide technical support on the design-kit. Several support levels are addressed (e.g. installation issues, use of the technology files or libraries, design-flow, etc.). To request support, users can create tickets through CMP DK Support Center. This new interface between CMP and design-kits users, dedicated to technical support, is available on CMP web site

Prices are exclusive of taxes and duties and can be changed at any time without prior notice.
Prices in US$ will be converted from Euro at the time of the delivery for invoicing.

Prices from February 2015
ams(1) 0.18u CMOS C18A6 1200 Euro/mm2 (2)
0.18u HV-CMOS H18A6 1200 Euro/mm2 (2)
0.35u CMOS C35B4C3 650 Euro/mm2 (3)
0.35u CMOS Bulk Micromachining 650 Euro/mm2 (4)
  + 3700 Euro for 10 dies
0.35u CMOS C35B4M3 890 Euro/mm2 (4)
0.35u CMOS-Opto C35B4O1 810 Euro/mm2 (3)
0.35u SiGe BiCMOS S35D4M5 890 Euro/mm2 (4)
0.35u HV-CMOS H35B4D3 1000 Euro/mm2 (5)
STMicroelectronics(1)
28nm FDSOI CMOS28FDSOI 12000 Euro/mm2 (6)
36000 Euro/block -> Each block is 2x2mm2 (including scribes: effective design surface:1,88x1,88mm2)
Special price for CNRS Institutions: 9000 Euro/mm2 (6)
65nm CMOS CMOS065 6000 Euro/mm2 (6) if Area less or equal to 5mm2
30000Euro + [(Area-5) * 4250 Euro] if 5mm2 Area < 15mm2(7)
130nm CMOS HCMOS9GP 2200 Euro/mm2 (6) if Area less or equal to 5mm2
11000 Euro + [(Area-5) * 2000 Euro] if 5mm2 < Area < 15mm2 (7)
130nm SiGe BiCMOS9MW 2900 Euro/mm2 (6) if Area less or equal to 5mm2
14500 Euro + [(Area-5) * 2300 Euro] if 5mm2 < Area < 15mm2 (7)
130nm SOI H9SOI-FEM 2200 Euro/mm2 (6) if Area less or equal to 5mm2
11000 Euro + [(Area-5) * 1800 Euro] if 5mm2 < Area < 15mm2 (7)
130nm CMOS HCMOS9A 2200 Euro/mm2 (6) if Area less or equal to 5mm2
11000 Euro + [(Area-5) * 1900Euro] if 5mm2 < Area < 15mm2 (7)
0.18u BCD BCD8sP 2600 Euro/mm2 (6) if Area less or equal to 5mm2
13000 Euro + [(Area-5) * 2100 Euro] if 5mm2 < Area < 15mm2 (7)
MEMSCAP PolyMUMPs $ 3,700 (8) (9) (10) (13)
$ 4,600 (11) (9) (10) (13)
SOI MUMPs $ 3,700 (8) (9) (10) (14)
$ 4,600 (12) (9) (10) (14)
Metal MUMPs $ 3,700 (8) (10) (13)
$ 4,600 (11) (10) (13)
PiezoMUMPs $ 3,700 (8) (10) (13)
$ 4,600 (11) (10) (13)
TELEDYNE DALSA MIDIS $ 8,000 (4mm x 4mm) (8)(12)
$ 9,830 (4mm x 4mm) (11)(12)
$15,400 (4mm x 8mm) (8)(12)
$18,700 (4mm x 8mm) (11)(12)
$29,800 (8mm x 8mm) (8)(12)
$37,300 (8mm x 8mm) (11)(12)
Micralyne MicraGEM-Si

$ 4,800 (4mm x 4mm) (8) (12)
$ 6,000 (4mm x 4mm) (11) (12)
$ 7,200 (4mm x 8mm) (8) (12)
$ 8,000 (4mm x 8mm) (11) (12)
$12,000 (8mm x 8mm) (8) (12)
$12,650 (8mm x 8mm) (11) (12)

OPEN 3D
Bump, copper pillar & UBM (15)

Guaranteed minimum delivered pieces 40. Applicable only in 0.35u and 130, 65 and 28nm for projects and wafers processed through CMP

Area < 5mm2 5000Euro + 1500Euro/mm2+ additional fees (16) (17)
5mm2 < Area < 15 mm2 12500Euro + 1000Euro/mm2+ additional fees (16) (17)
Area > 15mm2 22500Euro + 500Euro/mm2+ additional fees (16) (17)
Dedicated post process run: contact CMP

TSV (15)

Guaranteed minimum delivered pieces 40. Applicable only in 130nm and 65nm MPW for projects and wafers processed through CMP

Area<5mm 2 15000Euro + 5000Euro/mm2+ additional fees (16) (17)
5mm2< Area<15 mm2 40000Euro + 3000Euro/mm2+ additional fees (16) (17)
Area>15mm2 70000Euro + 1000Euro/mm2+ additional fees (16) (17)
Dedicated post process run: contact CMP

Silicon interposer including UBM 3M+1TM interposer (15)

Minimum charge 50kEuro for silicon interposers below or equal to 100mm2
Guaranteed minimum delivered pieces 40.

Area < 100mm2 50000Euro
100mm2 < Area < 200 mm2 50000Euro + 250Euro/mm2
Area > 200mm2 75000Euro + 200Euro/mm2
Dedicated silicon interposer process run: 110kEuro for 3 wafers delivered (number of pieces function of interposer dimensions.

Notes:

  1. Area = (X+0.12)*(Y+0.12)mm2.
  2. Minimum charge is the price of 5,55 mm2 (X+0.12)*(Y+0.12)mm2.
  3. Minimum charge is the price of 3,43 mm2 (X+0.12)*(Y+0.12)mm2.
  4. Minimum charge is the price of 4,49 mm2 (X+0.12)*(Y+0.12)mm2.
  5. Minimum charge is the price of 7,65 mm2 (X+0.12)*(Y+0.12)mm2.
  6. Minimum charge is the price of 1,25 mm2 (X+0.12)*(Y+0.12)mm2.
  7. Contact CMP for a price quotation when Area is larger
  8. Price for Educational Institutions and Research Laboratories.
  9. Additional prices for Subdicing and Release:
    - Subdicing: $ 220 per cut lane and per 15 chips,
    - HF Release: $ 870 flat rate for up to 60 die/subdie,
    - Supercritical CO2 Dry: $ 1,100 flat rate for up to 60 die/subdie.
  10. Contact CMP for multiple location prices.
  11. Price for Industrial Companies.
  12. Fixed size.
  13. For 15 identical chips, 1cm x 1cm (fixed size).
  14. For 15 identical chips 0,9cm x 0,9cm (fixed size).
  15. Includes, repassivation, seed layer, copper pillar and soldering capping
  16. Additional fees are applied function of the silicon MPW technology : 4kEuro in 0.35µm ams/ 3kEuro in 130nm STM/ 7kEuro in 65nm STM/ 11kEuro in 28nm STM.
  17. Option for flip chip assembly on provided substrates (max 50x50mm2): 5kEuro for 40 pieces. For other request, please contact CMP.

Packaging price list

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