Ceramic packages are DIL, CQFP, LCC, JLCC, PGA and SOIC.

Plastic packages "open cavity" are TQFP, QFN.

Plastic packages are PLCC, PQFP, SOIC, SSOP, TSSOP, QFN, PBGA.

Metallic package, hybrid, Chip-Scale-Package … solutions may be provided on request.

Conditioning of wafers and naked dies (vacuum or nitrogen atmosphere)

See also: Price list, Documents, Leadframe diagrams, Guidelines