PQFP (Plastic Quad Flat Package)

(Popular among quad packages)

PLCC (Plastic Leaded Chip Carrier)

Leads number:

PLCC 20
PLCC 28
PLCC 44

SOIC (Thin Small Outline Integrated Circuit)

Leads number:

SOIC 8
SOIC 16
SOIC 20
SOIC 24
SOIC 28

SSOP/TSSOP (Small Shrink Outline Package / Thin Small Shrink Outline Package)

Leads number:

SSOP 28


TSSOP 8
TSSOP 10
TSSOP 20
TSSOP 24
TSSOP 28
TSSOP 38

QFN (Quad Flat Non Leaded)

Lead number:

QFN 12
QFN 16
QFN 24
QFN 28
QFN 32
QFN 36
QFN 40
QFN 44
QFN 48
QFN 52
QFN 56
QFN 64
QFN 80

PBGA (Plastic Ball-Grid Array)

(IC packages which place output pins in the form of solder ball matrix. ).
Lead number:

PBGA 204
PBGA 225
PBGA 256
PBGA 352/388
PBGA 420/456

Stacked dies / COB (Chip On Board) / Flip-Chip / MCM - SiP (System in Chip) possibilites.