Design-Kits (DK)

CMP distributes design-kits, containing principally standard cell libraries, models for specific software tools and design rules.
CMP handles more than 40 design-kits, corresponding to IC’s, Photonic IC’s or MEM’s technologies from different foundries.

DK are delivered after signature of a NDA/CLA and on condition that the designs are submitted to CMP for fabrication. Users are informed by CMP when a new DK release is issued, they can update their version.
CMP supports the customers through a DK Support center interface.

The following table always includes current releases. More details in each technology of the Process Catalog:

Foundry Process Frontend Backend tools Version Notes
ams IC 0.35um CMOS C35B4C3 Cadence IC 5.1.41_USR6 3.80
Cadence IC 6.1.5 4.10 April 2016
Tanner/L-Edit Version 15 7.5
ams IC 0.35um SiGe BiCMOS S35D4 Cadence 5.1.41_USR6 3.80
Cadence 6.1.5 4.10 April 2016
ams IC 0.35um HV CMOS H35B4D3 Cadence IC 5.1.41_USR6 3.80
Cadence IC 6.1.5 4.10 April 2016
ams IC 0.18um CMOS C18 Cadence IC 5.1.41 3.78
Cadence IC 6.1.5 4.11 April 2016
ams IC 0.18um HV CMOS H18 Cadence IC 5.1.41 3.78
Cadence IC 6.1.5 4.11 April 2016
STMicroelectronics IC 130nm CMOS HCMOS9GP Cadence IC 5.1.41_USR6 9.2
STMicroelectronics IC 130nm CMOS HCMOS9A Cadence IC 6.1.6 10.7 July 2016
STMicroelectronics IC 130nm CMOS H9SOI-FEM Cadence IC 5.1.41_USR6, Cadence IC 6.1.6 14.1
STMicroelectronics IC 130nm CMOS BiCMOS9-MW Cadence IC 5.1.41_USR6, Cadence IC 6.1.5 2.7
STMicroelectronics IC 65nm CMOS CMOS065 Cadence IC 5.1.41_USR6, Cadence IC 6.1.5 5.3.7
STMicroelectronics IC 55nm BiCMOS SiGe BiCMOS055 Cadence IC 6.1.6 2.4
STMicroelectronics IC 28nm FDSOI CMOS28FSOI Cadence IC 6.1.6 2.7.a
STMicroelectronics IC 180nm BCD BCD8sP Cadence IC 6.1.6 2.0.a
IRT Nanoelec/LETI-CEA IC Si310–PHMP2M Cadence IC 6.1.6 1.3
MEMSCAP PiezoMUMPS Cadence 5.1.41 1.0 1
Cadence 6.1.5 1.0 1
Tanner 1.0 1
MEMSCAP SOIMUMPS Cadence 1
Tanner 1
Mentor Graphics 1
MEMSCAP MetalMUMPS Cadence 1
Tanner 1
Mentor Graphics 1
MEMSCAP PolyMUMPS Cadence 1
Tanner 1
Mentor Graphics 1
Bulk Micromachining ams Cadence 1
+ Post process Tanner 1

Notes:
1. Design rules, technology files, DRC

Procedure

To receive the Confidentiality Agreements and/or design kit or documentation distributed by CMP, fill in the Design-Kit request.

Delivery

NDA/CLA and next the Design Kit/Documentation, are sent by one month (time for Foundries agreements to be approved and for the export licence, necessary for non EC countries).

Price

free of charge for all designed circuits fabricated through CMP runs. Full information is sent in the first signed document named “Confidentiality and Licence Agreement”.

TWO original forms of the Confidentiality Agreements are mandatory.

Design Kit Support Center

A dedicated interface to technical support is available on a secure web site. Several support levels are addressed (e.g. installation issues, use of the technology files or libraries, design-flow, etc.) through different tickets.
Support center