Design-Kits (DK)

CMP distributes Design-Kits (DKs), containing principally standard cell libraries, models for specific software tools and design rules.
CMP handles more than 40 design-kits, corresponding to IC’s, Photonic IC’s or MEMS technologies from different foundries.

DK are delivered after signature of a NDA/CLA and on condition that the designs are submitted to CMP for fabrication. Users are informed by CMP when a new DK release is issued, they can update their version.
CMP supports the customers through a DK Support center interface.

The following table always includes current releases. More details in each technology of the Process Catalog:

Foundry Process Frontend Backend tools Version Notes
ams IC 0.35um BARC C35B4OA Cadence IC 6.1.6 4.10 ISR15 Nov.-17
ams IC 0.35um CMOS C35B4C3 Cadence IC 6.1.6 4.10 ISR15 Nov.-17
ams IC 0.35um CMOS/Flash/EEPROM C35B4E3 Cadence IC 6.1.6 4.10 ISR15 Nov.-17
ams IC 0.35um ARC C35B4O1 Cadence IC 6.1.6 4.10 ISR15 Nov.-17
ams IC 0.35um RF C35B4M3 Cadence IC 6.1.6 4.10 ISR15 Nov.-17
ams IC 0.35um HV CMOS H35B4D3 Cadence IC 6.1.6 4.10 ISR15 Nov.-17
ams IC 0.35um SiGe BiCMOS S35D4M5 Cadence IC 6.1.6 4.10 ISR15 Nov.-17
STMicroelectronics IC 130nm CMOS HCMOS9A Cadence IC 6.1.7 10.9 May-19
STMicroelectronics IC 130nm CMOS BiCMOS9-MW Cadence IC 6.1.7 3.4 Oct-20
STMicroelectronics IC 65nm CMOS CMOS065 Cadence IC 6.1.6 5.8 Jul.-19
STMicroelectronics IC 55nm BiCMOS SiGe BiCMOS055 Cadence IC 6.1.7 3.1a May-20
STMicroelectronics IC 28nm FDSOI CMOS28FSOI Cadence IC 6.1.7 1.3.a Fev.-21
STMicroelectronics IC 160nm BCD BCD8sP Cadence IC 6.1.6 2.4 2016
STMicroelectronics IC 160nm BCD BCD8s-SOI Cadence IC 6.1.7 2.1 2017
STMicroelectronics/IRT Nanoelec/LETI-CEA IC 130nm CMOS HCMOS9A/MAD200v3 Cadence IC 6.1.7/Addon NVM H9A@2018.4.1 10.9/2018.4.1 May-19
IRT Nanoelec/LETI-CEA IC Si310–PHMP2M Cadence IC 6.1.7 2019.4 March-20
AMF Si-Photonics IC SiP Synopsys Opto Designer 2020.09-1 3.1.2 Jan.-21
AMF Si-Photonics IC SiP Mentor Pyxis 3.0 Sept.-20
AMF Si-Photonics IC SiP Luceda IPKISS / Tanner L-Edit 2018.3 3.1 Nov.-20
AMF Si-Photonics IC SiP MentorGraphics L-Edit Photonics Sept.-20
em microelectronic IC 0.18µm CMOS EMALP018 logic Cadence IC 6.1.7 2.1 May-20
ON Semiconductor IC 0.18µm CMOS ONC18MS Cadence 6 1.32p2 Dec.-19
ON Semiconductor IC 0.18µm CMOS HV ONC18I4T Cadence 6 1.32p2 Dec.-19
ON Semiconductor IC 0.35µm CMOS ONC35U Cadence 6 1.4p2 Jul.-20
ON Semiconductor IC 0.35µm CMOS HV ONC35-I3T25U Cadence 6 1.4p2 Jul.-20
ON Semiconductor IC 0.35µm CMOS HV ONC35I3T50U Cadence 6 1.5 Jul.-20
MEMSCAP PolyMUMPS Cadence 6.1.6 1.2 March-20
MEMSCAP SOIMUMPS Cadence 6.1.6 1.2 March-20
MEMSCAP PiezoMUMPS Cadence IC 6.1.6 1.2 March-20
Bulk Micromachining ams+post process Cadence 6.1.6 4.10 ISR15 Nov.-17

Procedure

To receive the Confidentiality Agreements and/or design kit or documentation distributed by CMP, fill in the Design-Kit request.

Delivery

NDA/CLA and next the Design Kit/Documentation, are sent by one month (time for Foundries agreements to be approved and for the export licence, necessary for non EC countries).

Price

Free of charge for all designed circuits fabricated through CMP runs. Full information is sent in the first signed document named “Confidentiality and Licence Agreement”.

TWO original forms of the Confidentiality Agreements are mandatory.

Design Kit Support Center

A dedicated interface to technical support is available on a secure web site. Several support levels are addressed (e.g. installation issues, use of the technology files or libraries, design-flow, etc.) through different tickets.
Support center